Can I check whether a SMP central is successfully bonded/paired with any SMP peripheral device, on 825x?
Nov 16, 2022 16:09
In our project, we use one 825x module as master and one 825x module as slave/remote control module, and we deploy SMP in application. On master side, during machine power on self test, we want to check and make sure it's been successfully bonded(while the remote control/slave side may be in sleep mode), after pairing/bonding operation in mfg build. After I checked in User's hand book, I could not find an API function to easily do this job. What should I do to implement this feature?
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Hi,
you can read the flash addr at 0x78000,it saved all slave MACs that has bond,and find the details in handbook 3.3.4.5 master SMP
Thank you Soyo. I have worked out some codes of checking the bonding state on BLE Master side. However I have encounter another problem. I wanted to deploy 'telink_adv_trigger_paring_8258' shown in your 825x_master_kma_dongle demo. My understanding is that I should set blsAdvData with the same special trigger packet on Slave side(although any dome in slave role didn't show this kind of codes), but could not successfully get the right packet on Master side, and data in the event_adv_report_t always show the data len is 1, while the telink_adv_trigger_paring_8258[] is 8-byte long. What may be wrong with this trigger-pairing codes? Could you give me an example of thie method?